Recently, Innolaser released a record sheet of investor relations activities. Among them, it was mentioned that the company's ultra-fast laser drilling equipment obtained the first order in the IC carrier board field at the end of 2025 with its excellent performance such as stable processing of various aperture sizes such as 30-100 μm and drilling efficiency of up to 10,000 holes/s, and completed acceptance in the first half of this year. At the same time, this equipment can meet the precision drilling requirements of carrier boards and PCBs with M8 and M9 specifications. Suitable materials include ABF, CBF, BT, Q cloth, ceramics, PTFE, etc., and customer verification is being accelerated.

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