• Wiwynn showcased next-generation AI infrastructure at the 2026 OCP Global Summit in San Jose on Oct. 12, 2026.
• Highlights included rack-scale platforms for NVIDIA Vera Rubin NVL72 and AMD’s Helios rackscale architecture, targeting large-scale AI deployment.
• Unveiled advanced liquid-cooling concepts aimed at higher rack power density, including a 6 kW double-sided cold plate design.
• Demonstrated co-packaged optics rack integration with partners, positioning optical interconnect as a response to AI networking bottlenecks.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Wiwynn Corporation published the original content used to generate this news brief via PR Newswire (Ref. ID: 202610121500PR_NEWS_USPR_____HK69575) on October 12, 2026, and is solely responsible for the information contained therein.