According to TrendForce Jibang Consulting's latest AI interconnection technology research, as AI data centers push up high-speed transmission requirements, co-packaged optics are gradually moving towards mass production. Shortening test time and reducing costs have become important topics. Since CPO needs to collaborate on electrical and optical measurements, the need for integration of test equipment and software is increasing, and it is estimated that 2027 will be a critical year for test architectures to converge. While major manufacturers of traditional semiconductor automatic test equipment are actively deploying, new processes and technical challenges have also created new business opportunities for related equipment, test interfaces, and packaging and testing service providers.

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