On October 12, at the 26th China International Industry Fair Integrated Circuit Exhibition, Shenghe Jingwei officially unveiled the self-developed SmartPoser® -BD high-performance computing packaging technology platform based on silicon bridge interconnect technology, and announced that the 2.5D silicon bridge technology with a single package size of 6 times the mask has completed phased verification and has the ability to undertake customer product introduction and verification.

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