• nVent Electric entered a collaboration with AMD to develop rack-level cooling for AMD’s Helios Rackscale AI platform.
• The partnership adds nVent rear-door heat exchanger cooling to Helios to support high-density AI deployments at scale.
• Companies plan to show an initial look of the open-source solution at the OCP Global Summit in San Jose, Oct. 12-16, 2026.
• nVent’s DC-powered dual rear-door unit targets the double-wide Helios rack to capture residual heat from liquid cooling.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. nVent Electric plc published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202610130800PRIMZONEFULLFEED9844176) on October 13, 2026, and is solely responsible for the information contained therein.