nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads
The companies will unveil a first look of the open-source solution at the OCP Global Summit
LONDON, Oct. 13, 2026 (GLOBE NEWSWIRE) -- nVent (NYSE:NVT) and AMD today announced a collaboration to bring rack-level cooling to the AMD Helios™ Rackscale solution. The joint effort pairs nVent's data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct™ graphical processing units (GPUs), EPYC™ central processing units (CPUs), Pensando™ networking technologies, and the AMD ROCm™ open software stack. nVent will unveil a first look at the OCP Global Summit in San Jose, CA, October 12 to 16, 2026.
nVent's DC-powered RDHx is an industry-first dual rear door, designed for the double-wide AMD Helios rack. It captures the heat that direct-to-chip liquid cooling leaves behind and returns cooled air to the space, keeping the rack effectively room-neutral. It is fully-integrated with the AMD Helios platform and offers intelligent cooling with no wasted watts, integrated air temperature, humidity sensors and differential pressure fan speed control. Additionally, its DC power matches how next-generation AI racks are powered. The result is a cooling solution that allows customers to start with a single rack and scale larger deployments over time.
At the OCP Global Summit, nVent and AMD will show the RDHx for the first time on an Open Rack Wide (ORW) rack alongside the manifolds, bus bars, and power shelves of a Helios deployment, giving operators a first look at how the companies' work comes together. Visit Booth #A9 at OCP for more information.