On October 14, at the 2026 Wanchip Exhibition, China Micro introduced the two newly released high-end semiconductor microprocessing equipment — Primo XD-RIE™ extremely high aspect ratio etching equipment and Prefima Unicore™ AM 12-inch ALD molybdenum equipment. According to reports, China Micro will develop more than 20 new high-end thin film devices within five years to help the needs of 7 nm to 3 nm and more advanced logic devices, 300 to 500 layers and above, and more advanced memory devices.

Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.