• IBM entered a research collaboration with Siemens to advance its nanostack transistor architecture toward manufacturing readiness.
• Work targets design, simulation, lithography techniques beyond the current 7-angstrom node to speed development cycles.
• Partnership includes building virtual nanostack models to optimize performance, refine designs, pre-empt fabrication issues before chips are built.
• Nanostack vertically stacks nanosheet transistors, targeting nearly 100 billion transistors in a fingernail-sized area at 7 angstrom.

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