IBM and Siemens announced a research and development cooperation to jointly advance IBM's nano-stack architecture and integrate IBM's semiconductor device technology to accumulate software capabilities with Siemens electronic design automation and manufacturing software. IBM is responsible for semiconductor device innovation; Siemens provides EDA tools, process simulation, lithography optimization, and advanced manufacturing software. Nano-stacking is a three-dimensional design based on nanosheets, and transistors are stacked vertically. A nail-sized chip can integrate approximately 100 billion transistors under the 7 Egypt process node. The two sides will cooperate to build an advanced virtual model of nano-stacking to optimize design and solve manufacturing problems before streaming.

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