According to the CITIC Securities Research Report, the electrical performance requirements for core materials continue to increase under the iterative path of copper-clad plates, and the amount and value of chemical-grade silicon powder added to high-end copper-clad plates above M8 level has increased significantly. Furthermore, to further break through the extreme dielectric properties of resins, etc., the structure of chemical silicon powder requires further iteration. Chemical silicon powder will become the core material in the iterative path of high-end copper-clad plates, and its importance will increase as the grade of copper-clad plates increases. Leading overseas silicon powder companies are expanding production slowly. Leading domestic companies will take on incremental shares, and the chemical silicon powder technology route will catch up, and it is expected that profit growth higher than the industry's growth rate will be achieved.

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