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North China Chuang (002371.SZ) plans to acquire 100% of Nuohe Jianwei's shares for 405 million yuan
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Zhitong Finance App News, Beifang Huachuang (002371.SZ) issued an announcement. Beijing North Huachuang Microelectronics Equipment Co., Ltd. (hereinafter referred to as “North Huachuang Microelectronics”), a wholly-owned subsidiary of the company, signed an “Equity Transfer Agreement” with the Beijing Integrated Circuit Equipment Industry Investment and M&A Phase II Fund (hereinafter referred to as “Equipment Phase II Fund”) on October 15, 2026. North Huachuang Microelectronics plans to acquire 100% of the shares of Beijing Nuohuangwei Equipment Co., Ltd. (hereinafter referred to as “Beihuangwei”) in cash. For 4.05 billion yuan.

In 2025 and the first half of 2026, Novartis's operating profit and net profit were negative, mainly due to the fact that its core product hybrid bonding equipment is still in the stages of technology iteration, product verification and market introduction, small operating income scale and large R&D investment. Hybrid bonding is a key process for achieving ultra-high density interconnection. Hybrid bonding equipment is a key equipment that supports the core process of advanced packaging, and is widely used in 3D integration fields such as SoC, HBM, and Chiplet. Novo has formed key technical reserves in the core aspects of hybrid bonding equipment such as optical alignment, compensation algorithms, mechanical motion control, precision vibration control, and bonding head design. The factory equipment has achieved nanoscale precision alignment, products have received repeated orders, and is cooperating with many other leading customers to carry out equipment verification and intended order negotiations, and has strong market competitiveness and good development prospects.

After the acquisition is completed, Novartis will be included in the scope of the company's consolidated statements. The two parties' businesses are complementary. This acquisition is conducive to leveraging synergy effects, significantly enhancing the company's market competitiveness in hybrid bonding equipment and 3D integrated full-process equipment platforms, efficiently matching industry development needs, and better serving customers.

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