• Laserssel secured a 462.1 million won contract to supply semiconductor bonding equipment to Nadex in Japan.
• The order represents 9.87% of annual revenue.
• The contract runs from Oct. 20, 2026, to April 15, 2027, with full payment due the month following delivery.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Laserssel Co. Ltd. published the original content used to generate this news brief via DART, the regulatory disclosure system operated by the South Korea Financial Supervisory Service (FSS) (Ref. ID: 20261021900537), on October 21, 2026, and is solely responsible for the information contained therein.