News Summary:

• Substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron Technology Corporation will, in aggregate, drive a 2.5x increase in capacity over the next three years.
• Amkor plans to increase its advanced packaging capacity by more than 300% by the end of 2028.
• KYEC will build new facilities in the U.S., supported by a $1.1 billion capacity reservation advance from NVIDIA.
• SPIL is targeting to increase its optical-engine capacity for co-packaged optics by 15x by mid-2027, with aims for another doubling by the end of 2028.

BERLIN, Oct. 21, 2026 (GLOBE NEWSWIRE) -- GTC Berlin-- NVIDIA today announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform.

Working with Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL) and Unimicron Technology Corporation, NVIDIA is enabling new and existing suppliers to expand critical manufacturing capabilities across substrates, advanced packaging, testing and optical engines, strengthening the resiliency and redundancy of NVIDIA’s global supply chain.

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