Recently, China Micro announced that the world's first Primo Domingo® gas-phase highly selective etching equipment was successfully shipped to important domestic integrated circuit R&D and manufacturing customers. The three-dimensional chip architecture is becoming an important driving force to support the continuous shrinkage of chips, and the highly selective etching process is one of the most critical processes in 3D device manufacturing. In response to device process requirements such as GAA, 3D NAND, and 3D DRAM, China and Micro made important breakthroughs in the field of highly selective etching equipment, filling the gap in domestic autonomy of key etching processes in next-generation 3D semiconductor device manufacturing.
Zhitongcaijing · 2d ago
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Recently, China Micro announced that the world's first Primo Domingo® gas-phase highly selective etching equipment was successfully shipped to important domestic integrated circuit R&D and manufacturing customers. The three-dimensional chip architecture is becoming an important driving force to support the continuous shrinkage of chips, and the highly selective etching process is one of the most critical processes in 3D device manufacturing. In response to device process requirements such as GAA, 3D NAND, and 3D DRAM, China and Micro made important breakthroughs in the field of highly selective etching equipment, filling the gap in domestic autonomy of key etching processes in next-generation 3D semiconductor device manufacturing.
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