• UMC partnered with AP Memory to develop power delivery solutions for AI and high-performance computing systems.
• The collaboration combines deep trench capacitor manufacturing with AP Memory's silicon capacitor designs to improve power efficiency in advanced packages.
• AP Memory's S-SiCap Gen2D designs completed tape-out and initial functional validation in the third quarter of 2026.
• System-level performance and reliability testing in substrate packages is next; the partners are exploring expansion into capacitor-embedded interposers and landside capacitors.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. UMC - United Microelectronics Corporation published the original content used to generate this news brief via PR Newswire (Ref. ID: 202610220200PR_NEWS_USPR_____HK78678) on October 22, 2026, and is solely responsible for the information contained therein.