Recently, Slack held a report meeting on the results of the thermal control project. According to the company's basic performance tests, the diamond copper cold plate developed this time has the advantages of ultra-high thermal conductivity and low thermal expansion coefficient. It can solve the thermal barrier problems of high-power AI chips and is suitable for high-end thermal management scenarios such as computing power servers and high-power semiconductor devices. The company's thermal control team combines processes such as air pressure fusion, sintering, and diffusion welding to promote the development of two types of products: chip packaging heat dissipation and server cooling cold plates. At present, the company's diamond-copper composite cold plate project has achieved phased results. The thermal control team has completed sample development and performance verification, and will begin pre-production work.

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