We learned from China and Micro that the rise in the scale of the semiconductor manufacturing industry in this round is mainly driven by memory. Price factors have contributed the vast majority. The contribution of shipments is only about 20%, and the supply and demand for digital intelligence has not yet reached balance and satisfaction. As two-dimensional miniaturization approaches physical limits, three-dimensional structures such as 3D NAND, 3D DRAM, advanced packaging, and backside power supply become a breakthrough path. It stated, “The three-dimensional structure has profoundly changed the value distribution of equipment. Demand for equipment such as etching, film, measurement, and CMP continues to rise. This structural change in the value of equipment is a long-term and definite opportunity for companies to lay out in these fields ahead of time.”

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