ACM Research, Inc. ("ACM") (NASDAQ:ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China. The shipment marks another significant advance in ACM's core panel-level technologies and represents an important step forward in broadening its multi-product platform and expanding its global customer presence.

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