According to a Reuters report on the 28th, two people familiar with the matter revealed that Changxin Technology plans to start small-batch production of HBM3E. The HBM3E is an advanced high-bandwidth memory chip used in conjunction with an AI processor. According to people familiar with the matter, Changxin Technology has sent HBM3E samples to a number of AI chip design companies in China. According to people familiar with the matter, Changxin Technology is expected to start small-batch production within the next two months. Since the relevant production plans have not been disclosed to the public, the above people familiar with the matter requested anonymity. High-bandwidth memory is manufactured by stacking memory chips vertically to enable high-speed data interaction with AI processors, and is a key component for training and running special chips for large language models.

Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.