• Ulvac will deliver an invited presentation at ISMP 2026, scheduled for Nov. 3-6, 2026, in Busan, South Korea.
• The Nov. 4 presentation, from 16:55 to 17:20 KST, will cover PVD sputtering technology for seed-layer formation in through-glass vias.
• The company will also serve as a session chair in the ICEP Session.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Ulvac Inc. published the original content used to generate this news brief on October 30, 2026, and is solely responsible for the information contained therein.