At the 2026 Core and User Ecology Conference held today, Xinhe Semiconductor announced AgenteVo, an Agentic AI superintelligence platform for chip Taowe system law scenarios. It is used to orchestrate engineering tasks, and incorporates three superagents with advanced packaging, packaging and PCB, and multiphysics coupling. Jiang Liguo, vice president of R&D at Chip & Semiconductor, said that the platform is driven by time reduction and collaborative optimization of the architecture, which can increase design iteration efficiency by 4 times and reduce manual operation by 80%.

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