On October 30, the 2026 Core and Semiconductor User Ecology Conference was held in Shanghai, focusing on STCO and AI for EDA. At the conference, Chip & Semiconductor released the EDA2027 version, added a 3DIC PDK and optoelectronic joint simulation platform, and launched the Agentic AI superintelligence platform AgenteVo and the Physics AI trusted physical intelligence dock XAI. AI for EDA moved from a single point of function to platformization and commercialization.

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