Samsung Electronics Chairman Lee Jae-rong visited the Advanced Packaging Research Center in Yokohama, Japan on the 1st to inspect the progress of research and development of next-generation semiconductor packaging materials and process technology, and to discuss with local researchers to strengthen cooperation with Japanese semiconductor materials, components and equipment companies. Samsung Electronics plans to invest 40 billion yen over the next 5 years starting in 2024 to make Yokohama APL a global advanced packaging R&D center, and plans to expand the number of local R&D personnel to more than 100 people by 2027. The research field will also expand to next-generation packaging technologies such as wafer bonding and glass substrates.

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