On November 2, local time, Qualcomm announced that its first-generation high-bandwidth computing chip has completed hardware verification and successfully tested the complete memory read/write path and near-memory computing capabilities. The technology reduces data handling by bringing the computing unit closer to the memory to improve bandwidth and energy efficiency, and reduce the power consumption and cost of AI inference. Qualcomm said that a data center product has completed streaming, and preliminary testing of related logic substrates and stacked DRAM is ongoing. The DragonflyAI250 equipped with HBC technology is expected to provide samples in the first half of 2027.
Zhitongcaijing · 6d ago
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On November 2, local time, Qualcomm announced that its first-generation high-bandwidth computing chip has completed hardware verification and successfully tested the complete memory read/write path and near-memory computing capabilities. The technology reduces data handling by bringing the computing unit closer to the memory to improve bandwidth and energy efficiency, and reduce the power consumption and cost of AI inference. Qualcomm said that a data center product has completed streaming, and preliminary testing of related logic substrates and stacked DRAM is ongoing. The DragonflyAI250 equipped with HBC technology is expected to provide samples in the first half of 2027.
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