• TOK reported a second consecutive year of record performance in its Integrated Report 2026, driven by advanced semiconductor demand.
• Wafer-handling materials became a growth driver as demand for three-dimensional packaging expanded with generative AI applications.
• Capacity expansion is underway at manufacturing sites in Japan and South Korea to meet rising customer demand.
• Chinese photoresist manufacturers emerged as the biggest competitive risk, with domestic producers gaining market share in less advanced products.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. TOK - Tokyo Ohka Kogyo Co. Ltd. published the original content used to generate this news brief on November 06, 2026, and is solely responsible for the information contained therein.