• Schmid Group expects advanced packaging demand to drive growth, with substrate capacity falling short from 2027.
• Substrate manufacturers are pulling forward long-lead equipment orders for 2027-2028 production lines; substrate prices have risen 20% so far.
• The overall market is projected to grow at an 8% compound annual rate; package substrates are expected to grow about 15%.
• Panel-level packaging remains emerging, with production volumes expected from late 2026 at ASE and in 2027-2028 at PTI and TSMC.
• Glass-core projects have slipped to 2027-2030, while Schmid targets differentiation through integrated through-glass-via processing and seedless bottom-up filling.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 06, 2026, and is solely responsible for the information contained therein.