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Infineon showcases first 300-millimeter silicon carbide wafer at electronica
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Infineon showcases first 300-millimeter silicon carbide wafer at electronica
  • Infineon will attend the electronica trade show in Munich on Nov. 10-13, 2026.
  • Its showcase will feature the world's first processed 300-millimeter silicon carbide wafer, demonstrating functional power devices produced in a semiconductor fab.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Infineon Technologies AG published the original content used to generate this news brief on November 09, 2026, and is solely responsible for the information contained therein.

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