HTC Electronics announced that it plans to issue shares to no more than 35 specific targets, with a total capital of no more than 1 billion yuan. After deducting the issuance fee, it is intended to be used for chip polymer tantalum capacitor industrialization construction projects and ceramic film circuit and SLC industrialization construction projects. The offering still needs to be reviewed and approved by the National Defense Bureau of Science, Technology and Industry, reviewed and approved by the company's shareholders' meeting, and approved by the Shenzhen Stock Exchange and registered by the China Securities Regulatory Commission before it can be implemented.

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