SCHMID Group N.V. (NASDAQ:SHMD) (the "Company" or "SCHMID"), a leading global provider of advanced manufacturing equipment and solutions for the electronics industry, today announced that it has received an order for key process equipment from a U.S.-based pioneer in glass-based Advanced Packaging for its new glass core substrate manufacturing facility in South Asia.
According to the customer’s public announcements, the facility will be South Asia’s first Advanced Packaging site built around glass substrates and 3D heterogeneous integration. Once fully ramped, it is designed to produce around 70,000 glass panels per year, together with glass interposers and advanced 3D heterogeneous integration modules for AI, data center, 5G and aerospace & defense applications.
The project marks one of the first large-scale and significant steps towards volume manufacturing of glass core substrates – a substrate technology expected to become a key enabler for the next generation of AI processors, high-performance computing and data center hardware.
The customer has spent close to two decades developing proprietary photo-definable glass-ceramic and through-glass via (TGV) technology, protected by a broad patent portfolio and backed by leading semiconductor industry investors. With the new facility, the customer is moving its glass technology from development and pilot production into industrial-scale manufacturing.
SCHMID will supply key wet-process equipment for critical process steps in glass core substrate manufacturing, which are decisive for yield, reliability and cost.
Glass core substrates offer significant advantages over conventional organic cores: superior flatness and dimensional stability, lower warpage in large package formats, finer line/space structures, higher interconnect density and improved signal integrity. These properties are becoming essential as AI accelerators and chiplet-based architectures demand ever larger and more complex packages.
The order will be recorded in order intake for the fourth quarter of 2026.