The two chip companies Denglin Technology and Xinde Semiconductor will be listed on the Hong Kong Stock Exchange on Tuesday. GPU R&D company Denglin Technology issued 6.1 million shares at HK$231 per share and raised HK$1.41 billion. The issue price was at the lower end of the price range. Semiconductor packaging testing company Xinde Semiconductor issued 106.6 million shares at HK$88/share, raising HK$946 million. The issue price was also below the upper limit of the price range. The first-day performance of these two IPOs will be an important weather vane for the Hong Kong IPO market.
Zhitongcaijing · 3d ago
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The two chip companies Denglin Technology and Xinde Semiconductor will be listed on the Hong Kong Stock Exchange on Tuesday. GPU R&D company Denglin Technology issued 6.1 million shares at HK$231 per share and raised HK$1.41 billion. The issue price was at the lower end of the price range. Semiconductor packaging testing company Xinde Semiconductor issued 106.6 million shares at HK$88/share, raising HK$946 million. The issue price was also below the upper limit of the price range. The first-day performance of these two IPOs will be an important weather vane for the Hong Kong IPO market.
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