The Zhitong Finance App learned that Xinde Semiconductor (07672) was listed for the first time. According to the announcement, the price was HK$8.88 per share. A total of 106.5625 million shares were issued, 500 shares per lot, with a net proceeds of about HK$904 million. As of press release, it rose 20.5% to HK$10.7, with a turnover of HK$89.624 million.

According to the prospectus, Xinde Semiconductor is a semiconductor packaging and testing service provider, mainly engaged in developing package design and providing customized packaging products and packaging product testing services. According to Frost & Sullivan, in the “post-Moorish era” where transistor density growth was close to the limit of its scale, reliance on novel semiconductor packaging architectures as a key link in connecting chip design and application became a key driving force for improving chip performance, efficiency, and functional flexibility.

Since its establishment in September 2020, the Group has expanded the field of traditional and advanced packaging, accumulated knowledge of packaging technology, and has mass production capacity for traditional and advanced packaging, covering packaging products such as QFN, BGA, LGA, WLP and 2.5D/3D. The Group has built a “Chip and Advanced Packaging Technology Platform (CapIC)” covering all technical branches in the field of traditional and advanced packaging to promote the Group's technical knowledge and continue to develop new technologies.

Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.