04:02 AM EST, 11/10/2026 (MT Newswires) -- Hon Hai Precision Industry (HHPD.L), d/b/a Foxconn, plans to issue three series of corporate bonds on Nov. 11, according to a Tuesday filing. The Taiwanese electronics contract manufacturer's issue will comprise NT$1.90 billion of 2.30% bonds due Nov. 11, 2029, NT$7.40 billion of 2.35% bonds due Nov. 11, 2031, and NT$4.70 billion of 2.42% bonds due Nov. 11, 2036. The bonds will be issued at par, with interest payments to begin at issuance.

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