• HANMI Semiconductor will attend the Morgan Stanley Asia Pacific Summit in Singapore on Nov. 18-19, 2026.
• Meetings with overseas institutional investors will cover its 2027 growth strategy, including expanding HBM TC bonder market share and entering the US market.
• Capacity expansion plans include building a seventh factory and acquiring an eighth to address AI semiconductor equipment shortages.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. HANMI Semiconductor Co. Ltd. published the original content used to generate this news brief via DART, the regulatory disclosure system operated by the South Korea Financial Supervisory Service (FSS) (Ref. ID: 20261111800077), on November 11, 2026, and is solely responsible for the information contained therein.