On November 11, Chaoying Electronics released a record sheet of investor relations activities. Among them, it was pointed out that the Huangshi P3 project was reviewed and approved by the shareholders' meeting on August 24, 2026, and plans to invest 2,086 billion yuan to build high-layer and HDI printed circuit board production capacity, with a construction period of 24 months. P3's production capacity planning points to a breakthrough in storage PCB production capacity bottlenecks, expansion of high-end automotive electronics PCBs, and support for AI server PCBs. It is a core increase on the domestic side in the company's “domestic+overseas” dual production capacity framework.
Zhitongcaijing · 2d ago
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On November 11, Chaoying Electronics released a record sheet of investor relations activities. Among them, it was pointed out that the Huangshi P3 project was reviewed and approved by the shareholders' meeting on August 24, 2026, and plans to invest 2,086 billion yuan to build high-layer and HDI printed circuit board production capacity, with a construction period of 24 months. P3's production capacity planning points to a breakthrough in storage PCB production capacity bottlenecks, expansion of high-end automotive electronics PCBs, and support for AI server PCBs. It is a core increase on the domestic side in the company's “domestic+overseas” dual production capacity framework.
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