• Hi Sun Technology (China) established its RMB 232 million second-phase asset-backed securities scheme on November 12, 2026.
• The issuance comprises RMB 174 million in priority securities and RMB 58 million in subordinated securities.
• The priority tranche carries a 2.33% coupon; both tranches have an expected maturity date of October 31, 2028.
• Proceeds will principally fund general working capital for the group's fintech services business.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hi Sun Technology (China) Limited published the original content used to generate this news brief via IIS, the regulatory disclosure system operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20261112-12410380), on November 12, 2026, and is solely responsible for the information contained therein.