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TE Connectivity Invests More Than $60M In New York R&D And Manufacturing Facility
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The 135,000 square foot facility will accelerate the development and production of TE's high-density fiber array units recently acquired from RAM Photonics designed to enable data center operators to transition to higher-density, lower-power architectures that are essential for the future of AI and cloud computing. TE's technology helps solve critical bottlenecks around performance, density and scalability of fiber attachment for co-packaged optics.

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