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Fujifilm, Quantum Flex Pack Present at Digital Packaging Summit
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Fujifilm, Quantum Flex Pack Present at Digital Packaging Summit
  • Fujifilm will present with Quantum Flex Pack at the Digital Packaging Summit, November 16-18, in Bonita Springs, Florida.
  • The session will examine expanding digital inkjet printing beyond short runs into mainstream flexible packaging production.
  • Quantum, the first U.S. customer to install the J Press FP790, began full production following installation in August 2026.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Fujifilm Holdings Corporation published the original content used to generate this news brief via Business Wire (Ref. ID: 202611121400BIZWIRE_USPR_____20261112_BW703194) on November 12, 2026, and is solely responsible for the information contained therein.

Disclaimer:This article represents the opinion of the author only. It does not represent the opinion of Webull, nor should it be viewed as an indication that Webull either agrees with or confirms the truthfulness or accuracy of the information. It should not be considered as investment advice from Webull or anyone else, nor should it be used as the basis of any investment decision.
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